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OSK 44NMST88 Solder Wetting Test Machine

We will conduct a solder wetting test for electronic components used in surface mounting, using the wetting balance method.

- Measures the surface tension (mN) and contact angle (degrees) of molten solder. - Records the progress of the test by filming it and converting it into an MPEG4 file. - Testing can be conducted using either the solder bath equilibrium method or the solder ball equilibrium method. - Complies with the following multiple international standards: IPC/EIA J-STD 002 1 003 JEDEC MIL 883 L IEC 68-2-69; IEC 68-2-58 NFC 89-400 - Features a durable and easy-to-maintain structure.

  • Analytical Equipment and Devices
  • Other measurement, recording and measuring instruments

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[Analysis Case] Solder Wetting Test for Semiconductor Packages

It is possible to conduct solder wetting tests on electrodes after accelerated degradation testing.

In electronic devices that use a lot of semiconductors, each component is mounted by soldering. If defects occur in the solder joints, it can lead to malfunctions in the electronic devices. Therefore, evaluating the wettability of solder is important for assessing the reliability of components. In this study, we artificially degraded the samples to examine how the wettability of the solder changes. After the constant temperature and humidity test, it was found that the wettability of the electrode surface changed. Measurement methods: Constant temperature and humidity test, solder wettability test Product fields: Power devices, LSI/memory, electronic components Analysis purpose: Degradation investigation, reliability evaluation For more details, please download the materials or contact us.

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  • Contract Analysis
  • Contract measurement

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Solder Wetting Test

Testing can be conducted using the solder pot balance method, solder ball balance method, and solder paste method.

It is compatible with both leaded and lead-free solder.

  • Contract measurement

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